IChipWhat is it
Chip. NameIntegrated circuitsYou can imagine it as a micro-electronic city。
A vivid metaphor:
Core foundation concept 1.Semiconductor
This is the physical foundation of the chip. Silicon is the most common semiconductor material, and the wonder is that its conductivity can be precisely controlled between the conductor and the insulation. By mixing different impurities, p-type semiconductors and n-type semiconductors can be formed, which is the basis for the construction of transistor tubes。
Transistors - "building blocks" of chips
This is the most basic and important unit of the chip. You can interpret it as a tiny electronic switch。
3. Binary
The chips recognize only two states: on (1) and off (0). All complex information (text, pictures, sound) and operations will eventually be converted into binary codes consisting of 0 and 1 and processed by transistor。
4. Logic the door
A combination of several transistor tubes is capable of performing basic logical operations (e. G., with, or without). It is the “building blocks” that make up complex computing functions。
5. Clock frequency
Like the metronome, commands all operations inside the chip to synchronize. 1ghz indicates a billion clock cycles per second. The higher the frequency, the faster the processing usually takes place (but also the higher effort and heat)。
Iii. How are the chips made
Chip manufacturing is one of the most complex processes to date. Its main processes can be divided into the following core steps:
Step 1: design
Step 2: manufacturing (front-track process)
It's done in the super-clean room, and the core is light。
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Photograms: placing photogels on the crystal circle, then using a photographer to pass through the masked version, and using ultraviolet "simulating" of the designed circuit map to the photogel. It's like washing pictures with a negative。
Corrosion: in chemical or physical methods, silica, which is not protected by optical glue, is carved out into a three-dimensional structure。
Ion injection: injects specific impurities into silicon, alters its conductivity and forms a transistor。
Sedimentation: placing a layer of metal guidance to connect the transistor。
These steps require dozens or even hundreds of repetitions in order to form complex layers of structures。
Step 3: seal and test (backtrack process)
Cut: the resulting crystal circle is cut into a small piece, each of which is a “crystal particle”。
Encapsulated: the crystal particles are attached to the base plate, their feet are connected with fine metal wires to the pint of the shell, and are finally sealed with epoxy resin. The chip behind the seal is what we normally see。
Test: a full functional and performance test of the sealed chip to ensure its conformity。
Iv. ChipsClassification
Mainly divided by function:
Processor chip: responsible for calculation and control (cpu, gpu, mmu)。
Storage chip: responsible for data storage (dram, nand flash)。
Logical chip: handles particular logic (asic, fpga)。
Simulation chip: handles signals from the real world (e. G. Sound, temperature)。
Sensor chip: perceptive physics world (e. G. Gyroscope, image sensor)。
V. Key technical nodes: process
What we often hear about 7 nm, 5 nm, 3 nm is the chip process。
Vi. Summary
Chips = integrated circuits: complex circuits manufactured on micro, semiconductors。
Transistor is the foundation: it is a mini-electronic switch that constructs the entire digital world with 0 and 1。
Designing is extremely complex: it requires hundreds of sophisticated processes, such as design, optical engraving, carving and containment tests。
Moore's law: a famous observation (rather than a physical law) indicates that the number of transistors that can be accommodated on the chip is approximately doubling every two years. Although it is slowing down, it has guided the semiconductor industry over the past 50 years。
Everywhere: from mobile phones, computers to cars and electricity, modern society operates with chips。
