Pcb basic conceptPcb designBasic pcb manufacturing process pcbPaste process30404pcb: prened cit board, which printed the circuit board base (core) is generally classified by the insulation of the base plate, with the common raw materials being panels, fibreglass fibreboards, and various forms of plastic sheeting. The pcb manufacturer, on the other hand, is commonly used in an insulation component consisting of glass fibre, non-weaves and resins, which is then suppressed by epoxy resin and copper beams into “semi-solidation film”. The thickness of the copper is in oz and 1oz is approximately 1. 2-1. 4mil. The basics and the main ingredients common to the base (core) are: fr-1 formaldehyde paper fr-2 formaldehyde paper fr-3 cotton paper, epoxy resin fr-4 glass cloth, epoxy resin fr-5 glass cloth, epoxy resin fr-6 wool glass, polyester g-10 glass sheet, epoxy resin cem-1 cotton paper, epoxy resin (flammation resistance) cem-2 cotton paper, epoxy resin (non-flammation) cem-3 glass cloth, epoxy resin cem-4 glass cloth, epoxy resin cer-5 glass cloth, polyester ain alumin aluminide sic carbonated sipelt with two-sided structures with copper skins and semi-solidized tablets. As shown in the figure below: metal coating metal coating is where the base plate lines are welded with electronic components. The cost of production is directly affected by different metal prices. In addition, differences in weldability, exposure and resistance values for each metal may directly affect the performance of the component. Common metal coatings are: copper tin: the thickness is usually between 5 and 15 m lead tin alloys (or tin copper alloys): i. E. Welds, the thickness is usually between 5 and 25 m and the tin content is about 63% gold: only silver coated on interfaces is usually plating: it is only plating on interfaces, or the words used to mark metal coatings with alloys that are also silver as a whole, e. G. Copper deposition, gold deposition, tin plating, silver plating, etc. Design software: levels of design process input such as allegro, pads, dxp: rationale file, web chart, sealing, design rules requirements, output, etc.: pcb drawings, gerber files, coordinates, processing requirements, commonly used terms describing superstitious structural features, negative layouts, wire-laying over-holes: perforation, blindness, hole welding, opening of windows, green oil-filled well faving (thermal welding) software, silkscreen: silk-printed paste: caste layer solder: weld-restructor layer: walk-by assembly: drill layer: drill-bed keepout: prohibited layer mechanical: different software with the same description and use of the above layers, but with the same practical and flexible use. The example of the profile understands that the composition of the stacking layer corresponds the layer in the chart to the definition of the layer in which a different perforation1 is found. 2 pre-treatment to remove contaminants from copper surfaces, increase roughness of copper surfaces and facilitate subsequent pressure membranes. After pre-treatment,3 the membranes will be treated with thermally resistant dry membranes, which are of various types and can form different processes, such as positives and negatives. The exposure uses the light source to transfer the image from the mask to the sensor base, the mask is divided into two types of negative, the left side is positive, the right side is negative, the general inner layer is negative and the outer layer is positive. 5 the dry membrane portion of the non-chemical reaction is partially washed out by the alkaline liquid effect of the visible. 6 corrosion uses the medicine to corrod the copper that emerges after the visible and to form circuit graphics. 7 decoding membrane uses strong alkalis to strip anti-corrosive layers that protect the copper surface and display circuit graphs. 8 the borehole is drilled in the required part and different drills are used for different apertures. 9 copper plating on the inner wall and surface layer of copper to increase the thickness of the copper layer in order to avoid the vulnerability of the conductor. 10 welding printing of welding ink on board, filling holes and protecting guidance lines. 11. Wireprints print text ink on board for identification purposes. 12 there are other procedures for multilayering, etc. There may also be other manufacturing processes or different manufacturing orders for different forms of panels. Specific processes can be analysed on a case-by-case basis. The above processes, as basic processes, facilitate understanding of pcb manufacture. Welds: welds for welding devices: the end for stickers
